Technical Features:
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High efficiency:
• High power density with scalable from 20KVA to 600KVA, max 30 power modules in parallel
• N+X redundancy with hot-swappable power module, bypass and monitoring module
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Reliable:
• All components in one module, since less fault points, higher reliability with less space required
• Each power module has an independent LCD, helps user to monitor different data and alarms in real time
• All components in one module, since less fault points, higher reliability with less space required
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Advanced technology:
• Integrated inner thermal sensors, display IGBT inner temperature directly
• Friendly interface
• Standard abundant interface: RS232, RS485, Dry contacts, USB
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Safety:
• Isolated air flow helps to flow cool air in the lower layer, keeping the upper PCB free of dust
• One air flow channel ensures fan redundancy, even one fan fails, power module can run normally
• Additional charging module for long time back up
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Application:
• Large Data Centers
• Sensitive Electronic Equipments
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